Feature/espp peripheral api update

[finger563]

Description

• Removed old esp-idf i2c configuration in favor of new espp::I2c class
• Updated function binding for magnetic encoder peripheral on i2c bus
• Updated espp submodule for latest peripheral APIs and new espp::I2c class

Motivation and Context

Simplifies the code and keeps it up to date with the espp submodule for clarity.

How has this been tested?

Building the example.

Screenshots (if appropriate, e.g. schematic, board, console logs, lab pictures):

Types of changes

• Bug fix (non-breaking change which fixes an issue)
• New feature (non-breaking change which adds functionality)
• Breaking change (fix or feature that would cause existing functionality to not work as expected)
• Documentation Update
• Hardware (schematic, board, system design) change
• Software change

Checklist:

• My change requires a change to the documentation.
• I have added / updated the documentation related to this change via either README or WIKI

Software

• I have added tests to cover my changes.
• I have updated the .github/workflows/build.yml file to add my new test to the automated cloud build github action.
• All new and existing tests passed.
• My code follows the code style of this project.